Global 3D Semiconductor Packaging Market Report, published by Fior Markets, forecast that the global market is expected to reach $12 billion by 2024 from $4 billion in 2016, growing at a CAGR of 15.2% from 2016 to 2024. By geography, Asia-Pacific and Rest of the World (RoW) are expected to grow at a CAGR of 16.2% and 14.8%, respectively, during the forecast period.
“3D Semiconductor Packaging Market (By Technology Type: 3D Package-On-Package, 3D Wire-Bonded, 3D Fan-Out Based, 3D Through-Silicon-Via; By Materials Type: Bonding Wire, Organic Substrate, Encapsulation Resin, Leadframe, Ceramic Package, Die Attach Material; By Industry Vertical: Industrial, Electronics, Healthcare, IT & Telecommunication, Automotive & Transport, Aerospace & Defense; By Geography) Global Scenario, Market Size, Outlook, Trend and Forecast, 2015-2024″
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The global 3D semiconductor packaging market is majorly driven by increase in number of portable electronic devices, short replacement period of electronics products, and technological superiorities over 2D packaging technology. However, high initial capital investment would act as a restraint for the market. Growing trend of internet of things would provide several growth opportunities for the market in the coming years.
The global 3D semiconductor packaging market is bifurcated into technology, material type and industry vertical. By technology, the market is further segmented into 3D package-on-package, 3D wire-bonded, 3D through-silicon-via, 3D fan-out based, and others. 3D wire-bonded technology segment accounted for the largest market share in 2016. Material type segment includes bonding wire, encapsulation resin, organic substrate, leadframe, ceramic package, die attach material, and others. By industry vertical, the market is segregated into industrial, electronics, healthcare, IT & telecommunication, automotive & transport, aerospace & defense, and others. Electronics is the predominant segment and accounted for around half of the total market share in 2016, owing to increased adoption of 3D semiconductor packaging in portable electronic devices.
Geographically the market is categorized into North America, Europe, Asia-Pacific, and Rest of the World (RoW). Asia-Pacific accounted for the largest market share in 2016, and it is expected to continue its dominance during the forecast period. The growth is majorly attributed to increasing demand for these chips in China, Taiwan, and Japan. North America accounted for the second largest market share of 23.1%. In terms of growth, Asia-Pacific is expected to grow at the fastest CAGR of 16.2% during the forecast period 2016-2024.
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Major players in the 3D semiconductor packaging market include Siliconware Precision Industries Co., Amkor Technology, ASE group, Ltd., SÜSS MicroTec AG., International Business Machines Corporation (IBM), Jiangsu Changjiang Electronics Technology Co. Ltd., Qualcomm Technologies, Inc., Intel Corporation, STMicroelectronics, and Taiwan Semiconductor Manufacturing Company, among others.